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1 features ? low-voltage and standard-voltage operation ? 2.7 (v cc = 2.7v to 5.5v) ? 1.8 (v cc = 1.8v to 5.5v) internally organized 128 x 8 (1k), 256 x 8 (2k), 512 x 8 (4k), 1024 x 8 (8k) or 2048 x 8 (16k) 2-wire serial interface schmitt trigger, filtered inputs for noise suppression bi-directional data transfer protocol 100 khz (1.8v) and 400 khz (2.5v, 2.7v, 5v) compatibility write protect pin for hardware data protection 8-byte page (1k, 2k), 16-byte page (4k, 8k, 16k) write modes partial page writes are allowed self-timed write cycle (5 ms max) high-reliability ? endurance: 1 million write cycles ? data retention: 100 years automotive grade, extended temperature and lead-free/halogen-free devices available 8-lead pdip, 8-lead jedec soic, 8-lead map, 5-lead sot23, 8-lead tssop and 8-ball dbga2? packages description the at24c01a/02/04/08/16 provides 1024/2048/4096/8192/16384 bits of serial elec- trically erasable and programmable read-only memory (eeprom) organized as 128/256/512/1024/2048 words of 8 bits each. the device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. the at24c01a/02/04/08/16 is available in space-saving 8-lead pdip, 8-lead jedec soic, 8-lead map, 5-lead sot23 (at24c01a/at24c02/at24c04), 8- lead tssop and 8-ball dbga2 packages and is accessed via a 2-wire serial interface. in addition, the entire family is available in 2.7v (2.7v to 5.5v) and 1.8v (1.8v to 5.5v) versions. 2-wire serial eeprom 1k (128 x 8) 2k (256 x 8) 4k (512 x 8) 8k (1024 x 8) 16k (2048 x 8) at24c01a at24c02 at24c04 at24c08 (1) at24c16 (2) 0180r?seepr?4/04 note: 1. this device is not recom- mended for new designs. please refer to at24c08a. 2. this device is not recom- mended for new designs. please refer to at24c16a. pin configurations pin name function a0 - a2 address inputs sda serial data scl serial clock input wp write protect nc no connect gnd ground vcc power supply 8-lead soic 1 2 3 4 8 7 6 5 a0 a1 a2 gnd vcc wp scl sda 8-lead pdip 1 2 3 4 8 7 6 5 a0 a1 a2 gnd vcc wp scl sda 8-lead map bottom view 1 2 3 4 8 7 6 5 vcc wp scl sda a0 a1 a2 gnd 5-lead sot23 1 2 3 5 4 scl gnd sda wp vcc 8-ball dbga2 bottom view vcc wp scl sda a0 a1 a2 gnd 1 2 3 4 8 7 6 5 8-lead tssop 1 2 3 4 8 7 6 5 a0 a1 a2 gnd vcc wp scl sda 5-lead sot23 rotated (r) (1k only) 1 2 3 5 4 scl gnd sda vcc nc
2 at24c01a/02/04/08/16 0180r?seepr?4/04 block diagram absolute maximum ratings operating temperature.................................. -55 c to +125 c *notice: stresses beyond those listed under ?absolute maximum ratings? may cause permanent dam- age to the device. this is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. storage temperature ..................................... -65 c to +150 c voltage on any pin with respect to ground .....................................-1.0v to +7.0v maximum operating voltage .......................................... 6.25v dc output current........................................................ 5.0 ma
3 at24c01a/02/04/08/16 0180r?seepr?4/04 pin description serial clock (scl): the scl input is used to positive edge clock data into each eeprom device and negative edge clock data out of each device. serial data (sda): the sda pin is bi-directional for serial data transfer. this pin is open-drain driven and may be wire-ored with any number of other open-drain or open- collector devices. device/page addresses (a2, a1, a0): the a2, a1 and a0 pins are device address inputs that are hard wired for the at24c01a and the at24c02. as many as eight 1k/2k devices may be addressed on a single bus system (device addressing is discussed in detail under the device addressing section). the at24c04 uses the a2 and a1 inputs for hard wire addressing and a total of four 4k devices may be addressed on a single bus system. the a0 pin is a no connect. the at24c08 only uses the a2 input for hardwire addressing and a total of two 8k devices may be addressed on a single bus system. the a0 and a1 pins are no connects. the at24c16 does not use the device address pins, which limits the number of devices on a single bus to one. the a0, a1 and a2 pins are no connects. write protect (wp): the at24c01a/02/04/16 has a write protect pin that provides hardware data protection. the write protect pin allows normal read/write operations when connected to ground (gnd). when the write protect pin is connected to v cc , the write protection feature is enabled and operates as shown in the following table. notes: 1. this device is not recommended for new designs. please refer to at24c08a. 2. this device is not recommended for new designs. please refer to at24c16a. memory organization at24c01a, 1k serial eeprom: internally organized with 16 pages of 8 bytes each, the 1k requires a 7-bit data word address for random word addressing. at24c02, 2k serial eeprom: internally organized with 32 pages of 8 bytes each, the 2k requires an 8-bit data word address for random word addressing. at24c04, 4k serial eeprom: internally organized with 32 pages of 16 bytes each, the 4k requires a 9-bit data word address for random word addressing. at24c08, 8k serial eeprom: internally organized with 64 pages of 16 bytes each, the 8k requires a 10-bit data word address for random word addressing. at24c16, 16k serial eeprom: internally organized with 128 pages of 16 bytes each, the 16k requires an 11-bit data word address for random word addressing. wp pin status part of the array protected 24c01a 24c02 24c04 24c08 (1) 24c16 (2) at v cc full (1k) array full (2k) array full (4k) array normal read/ write operation upper half (8k) array at gnd normal read/write operations
4 at24c01a/02/04/08/16 0180r?seepr?4/04 note: 1. this parameter is characterized and is not 100% tested. note: 1. v il min and v ih max are reference only and are not tested. pin capacitance (1) applicable over recommended operating range from t a = 25 c, f = 1.0 mhz, v cc = +1.8v. symbol test condition max units conditions c i/o input/output capacitance (sda) 8 pf v i/o = 0v c in input capacitance (a 0 , a 1 , a 2 , scl) 6 pf v in = 0v dc characteristics applicable over recommended operating range from: t ai = -40 c to +85 c, v cc = +1.8v to +5.5v, t ae = -40 c to +125 c, v cc = +1.8v to +5.5v (unless otherwise noted). symbol parameter test condition min typ max units v cc1 supply voltage 1.8 5.5 v v cc2 supply voltage 2.5 5.5 v v cc3 supply voltage 2.7 5.5 v v cc4 supply voltage 4.5 5.5 v i cc supply current v cc = 5.0v read at 100 khz 0.4 1.0 ma i cc supply current v cc = 5.0v write at 100 khz 2.0 3.0 ma i sb1 standby current v cc = 1.8v v in = v cc or v ss 0.6 3.0 a i sb2 standby current v cc = 2.5v v in = v cc or v ss 1.4 4.0 a i sb3 standby current v cc = 2.7v v in = v cc or v ss 1.6 4.0 a i sb4 standby current v cc = 5.0v v in = v cc or v ss 8.0 18.0 a i li input leakage current v in = v cc or v ss 0.10 3.0 a i lo output leakage current v out = v cc or v ss 0.05 3.0 a v il input low level (1) -0.6 v cc x 0.3 v v ih input high level (1) v cc x 0.7 v cc + 0.5 v v ol2 output low level v cc = 3.0v i ol = 2.1 ma 0.4 v v ol1 output low level v cc = 1.8v i ol = 0.15 ma 0.2 v
5 at24c01a/02/04/08/16 0180r?seepr?4/04 note: 1. the 24c01a/02/04 bearing the process letter ?d? on the package (the mark is located in the lower right corner on the top side of the package), guarantees 400 khz (2.5 ? 5.0v). 2. this parameter is characterized and is not 100% tested. ac characteristics applicable over recommended operating range from t ai = -40 c to +85 c, v cc = +1.8v to +5.5v, t ae = -40 c to +125 c, v cc = +2.7v to +5.5v, cl = 1 ttl gate and 100 pf (unless otherwise noted). symbol parameter 1.8-volt 2.5, 2.7, 5.0-volt units min max min max f scl clock frequency, scl 100 400 (1) khz t low clock pulse width low 4.7 1.2 s t high clock pulse width high 4.0 0.6 s t i noise suppression time (2) 100 50 ns t aa clock low to data out valid 0.1 4.5 0.1 0.9 s t buf time the bus must be free before a new transmission can start (2) 4.7 1.2 s t hd.sta start hold time 4.0 0.6 s t su.sta start setup time 4.7 0.6 s t hd.dat data in hold time 0 0 s t su.dat data in setup time 200 100 ns t r inputs rise time (2) 1.0 0.3 s t f inputs fall time (2) 300 300 ns t su.sto stop setup time 4.7 0.6 s t dh data out hold time 100 50 ns t wr write cycle time 5 5 ms endurance (1) 5.0v, 25 c, byte mode 1m 1m write cycles
6 at24c01a/02/04/08/16 0180r?seepr?4/04 device operation clock and data transitions: the sda pin is normally pulled high with an exter- nal device. data on the sda pin may change only during scl low time periods (refer to data validity timing diagram). data changes during scl high periods will indicate a start or stop condition as defined below. start condition: a high-to-low transition of sda with scl high is a start condition which must precede any other command (refer to start and stop definition timing diagram). stop condition: a low-to-high transition of sda with scl high is a stop condition. after a read sequence, the stop command will place the eeprom in a standby power mode (refer to start and stop definition timing diagram). acknowledge: all addresses and data words are serially transmitted to and from the eeprom in 8-bit words. the eeprom sends a zero to acknowledge that it has received each word. this happens during the ninth clock cycle. standby mode: the at24c01a/02/04/08/16 features a low-power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the stop bit and the completion of any internal operations. memory reset: after an interruption in protocol, power loss or system reset, any 2- wire part can be reset by following these steps: 1. clock up to 9 cycles. 2. look for sda high in each cycle while scl is high. 3. create a start condition.
7 at24c01a/02/04/08/16 0180r?seepr?4/04 bus timing scl: serial clock, sda: serial data i/o write cycle timing scl: serial clock, sda: serial data i/o note: 1. the write cycle time t wr is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. t wr (1) stop condition start condition wordn ack 8th bit scl sda
8 at24c01a/02/04/08/16 0180r?seepr?4/04 data validity start and stop definition output acknowledge
9 at24c01a/02/04/08/16 0180r?seepr?4/04 device addressing the 1k, 2k, 4k, 8k and 16k eeprom devices all require an 8-bit device address word following a start condition to enable the chip for a read or write operation (refer to figure 1). the device address word consists of a mandatory one, zero sequence for the first four most significant bits as shown. this is common to all the eeprom devices. the next 3 bits are the a2, a1 and a0 device address bits for the 1k/2k eeprom. these 3 bits must compare to their corresponding hard-wired input pins. the 4k eeprom only uses the a2 and a1 device address bits with the third bit being a memory page address bit. the two device address bits must compare to their corre- sponding hard-wired input pins. the a0 pin is no connect. the 8k eeprom only uses the a2 device address bit with the next 2 bits being for memory page addressing. the a2 bit must compare to its corresponding hard-wired input pin. the a1 and a0 pins are no connect. the 16k does not use any device address bits but instead the 3 bits are used for mem- ory page addressing. these page addressing bits on the 4k, 8k and 16k devices should be considered the most significant bi ts of the data word address which follows. the a0, a1 and a2 pins are no connect. the eighth bit of the device address is the read/write operation select bit. a read opera- tion is initiated if this bit is high and a write operation is initiated if this bit is low. upon a compare of the device address, the eeprom will output a zero. if a compare is not made, the chip will return to a standby state. write operations byte write: a write operation requires an 8-bit data word address following the device address word and acknowledgment. upon receipt of this address, the eeprom will again respond with a zero and then clock in the first 8-bit data word. following receipt of the 8-bit data word, the eeprom will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condi- tion. at this time the eeprom enters an internally timed write cycle, t wr , to the nonvolatile memory. all inputs are disabled during this write cycle and the eeprom will not respond until the write is complete (refer to figure 2). pag e wr i te : the 1k/2k eeprom is capable of an 8-byte page write, and the 4k, 8k and 16k devices are capable of 16-byte page writes. a page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. instead, after the eeprom acknowledges receipt of the first data word, the microcontroller can transmit up to seven (1k/2k) or fifteen (4k, 8k, 16k) more data words. the eeprom will respond with a zero after each data word received. the microcontroller must terminate the page write sequence with a stop condition (refer to figure 3). the data word address lower three (1k/2k) or four (4k, 8k, 16k) bits are internally incremented following the receipt of each data word. the higher data word address bits are not incremented, retaining the memory page row location. when the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. if more than eight (1k/2k) or sixteen (4k, 8k, 16k) data words are transmitted to the eeprom, the data word address will ?roll over? and previ- ous data will be overwritten.
10 at24c01a/02/04/08/16 0180r?seepr?4/04 acknowledge polling: once the internally timed write cycle has started and the eeprom inputs are disabled, acknowledge polling can be initiated. this involves sending a start condition followed by the device address word. the read/write bit is representative of the operation desired. only if the internal write cycle has completed will the eeprom respond with a zero allowing the read or write sequence to continue. read operations read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. there are three read operations: current address read, random address read and sequential read. current address read: the internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. this address stays valid between operations as long as the chip power is maintained. the address ?roll over? during read is from the last byte of the last memory page to the first byte of the first page. the address ?roll over? during write is from the last byte of the current page to the first byte of the same page. once the device address with the read/write sele ct bit set to one is clocked in and acknowl- edged by the eeprom, the current address data word is serially clocked out. the microcontroller does not respond with an input zero but does generate a following stop condi- tion (refer to figure 4). random read: a random read requires a ?dummy? byte write sequence to load in the data word address. once the device address word and data word address are clocked in and acknowledged by the eeprom, the microcontroller must generate another start condition. the microcontroller now initiates a current address read by sending a device address with the read/write select bit high. the eeprom acknowledges the device address and serially clocks out the data word. the microcontroller does not respond with a zero but does generate a fol- lowing stop condition (refer to figure 5). sequential read: sequential reads are initiated by either a current address read or a ran- dom address read. after the microcontroller receives a data word, it responds with an acknowledge. as long as the eeprom receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. when the memory address limit is reached, the data word address will ?roll over? and the sequential read will con- tinue. the sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (refer to figure 6).
11 at24c01a/02/04/08/16 0180r?seepr?4/04 figure 1. device address notes: 1. this device is not recommended for new designs. please refer to at24c08a. 2. this device is not recommended for new designs. please refer to at24c16a. figure 2. byte write figure 3. page write (* = don?t care bit for 1k) 8k (1) 16k (2)
12 at24c01a/02/04/08/16 0180r?seepr?4/04 figure 4. current address read figure 5. random read (* = don?t care bit for 1k) figure 6. sequential read
13 at24c01a/02/04/08/16 0180r?seepr?4/04 note: for 2.7v devices used in the 4.5v to 5.5v range, please refer to performance values in the ac and dc characteristics table . at24c01a ordering information ordering code package operation range at24c01a-10pi-2.7 at24c01a-10si-2.7 at24c01a-10ti-2.7 at24c01ay1-10yi-2.7 at24c01a-10tsi-2.7 at24c01ar-10tsi-2.7 at24c01au3-10ui-2.7 8p3 8s1 8a2 8y1 5ts1 5ts1 8u3-1 industrial (-40 c to 85 c) at24c01a-10pi-1.8 at24c01a-10si-1.8 at24c01a-10ti-1.8 at24c01ay1-10yi-1.8 at24c01a-10tsi-1.8 at24c01au3-10ui-1.8 8p3 8s1 8a2 8y1 5ts1 8u3-1 industrial (-40 c to 85 c) at24c01a-10su-2.7 at24c01a-10su-1.8 at24c01a-10tu-2.7 at24c01a-10tu-1.8 8s1 8s1 8a2 8a2 lead-free/halogen-free/ industrial temperature (-40 c to 85 c) at24c01a-10se-2.7 8s1 high grade/extended temp (-40 c to 125 c) at24c01a-10sq-2.7 8s1 lead-free/halogen-free/ high grade/extended temp (-40 c to 125 c) package type 8p3 8-lead, 0.300" wide, plastic dual inline package (pdip) 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8a2 8-lead, 0.170" wide, thin shrink small outline package (tssop) 8y1 8-lead, 4.90 mm x 3.00 mm body, dual footprint, non-leaded, miniature array package (map) 5ts1 5-lead, 2.90 mm x 1.60 mm body, plastic thin shrink small outline package (sot23) 8u3-1 8-ball, die ball grid away package (dbga2) options -2.7 low-voltage (2.7v to 5.5v) -1.8 low-voltage (1.8v to 5.5v) r rotated pinout
14 at24c01a/02/04/08/16 0180r?seepr?4/04 note: for 2.7v devices used in the 4.5v to 5.5v range, please refer to performance values in the ac and dc characteristics table . at24c02 ordering information ordering code package operation range at24c02-10pi-2.7 at24c02n-10si-2.7 at24c02-10ti-2.7 at24c02y1-10yi-2.7 at24c02-10tsi-2.7 at24c02u3-10ui-2.7 8p3 8s1 8a2 8y1 5ts1 8u3-1 industrial (-40 c to 85 c) at24c02-10pi-1.8 at24c02n-10si-1.8 at24c02-10ti-1.8 at24c02y1-10yi-1.8 at24c02-10tsi-1.8 at24c02u3-10ui-1.8 8p3 8s1 8a2 8y1 5ts1 8u3-1 industrial (-40 c to 85 c) at24c02n-10su-2.7 at24c02n-10su-1.8 at24c02-10tu-2.7 at24c02-10tu-1.8 8s1 8s1 8a2 8a2 lead-free/halogen-free/ industrial temperature (-40 c to 85 c) at24c02n-10se-2.7 8s1 high grade/extended temp (-40 c to 125 c) at24c02n-10sq-2.7 8s1 lead-free/halogen-free/ high grade/extended temp (-40 c to 125 c) package type 8p3 8-lead, 0.300" wide, plastic dual inline package (pdip) 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8a2 8-lead, 0.170" wide, thin shrink small outline package (tssop) 8y1 8-lead, 4.90 mm x 3.00 mm body, dual footprint, non-leaded, miniature array package (map) 5ts1 5-lead, 2.90 mm x 1.60 mm body, plastic thin shrink small outline package (sot23) 8u3-1 8-ball, die ball grid away package (dbga2) options -2.7 low-voltage (2.7v to 5.5v) -1.8 low-voltage (1.8v to 5.5v)
15 at24c01a/02/04/08/16 0180r?seepr?4/04 note: for 2.7v devices used in the 4.5v to 5.5v range, please refer to performance values in the ac and dc characteristics table . at24c04 ordering information ordering code package operation range at24c04-10pi-2.7 at24c04n-10si-2.7 at24c04-10ti-2.7 at24c04y1-10yi-2.7 at24c04-10tsi-2.7 at24c04u3-10ui-2.7 8p3 8s1 8a2 8y1 5ts1 8u3-1 industrial (-40 c to 85 c) at24c04-10pi-1.8 at24c04n-10si-1.8 at24c04-10ti-1.8 at24c04y1-10yi-1.8 at24c04-10tsi-1.8 at24c04u3-10ui-1.8 8p3 8s1 8a2 8y1 5ts1 8u3-1 industrial (-40 c to 85 c) at24c04n-10su-2.7 at24c04n-10su-1.8 at24c04-10tu-2.7 at24c04-10tu-1.8 8s1 8s1 8a2 8a2 lead-free/halogen-free/ industrial temperature (-40 c to 85 c) at24c04n-10se-2.7 8s1 high grade/extended temp (-40 c to 125 c) at24c04n-10sq-2.7 8s1 lead-free/halogen-free/ high grade/extended temp (-40 c to 125 c) package type 8p3 8-lead, 0.300" wide, plastic dual inline package (pdip) 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8a2 8-lead, 0.170" wide, thin shrink small outline package (tssop) 8y1 8-lead, 4.90 mm x 3.00 mm body, dual footprint, non-leaded, miniature array package (map) 5ts1 5-lead, 2.90 mm x 1.60 mm body, plastic thin shrink small outline package (sot23) 8u3-1 8-ball, die ball grid away package (dbga2) options -2.7 low-voltage (2.7v to 5.5v) -1.8 low-voltage (1.8v to 5.5v)
16 at24c01a/02/04/08/16 0180r?seepr?4/04 notes: 1. for 2.7v devices used in the 4.5v to 5.5v range, please refer to performance values in the ac and dc characteristics ta ble. 2. this device is not recommended for new designs. please refer to at24c08a. at24c08 (2) ordering information ordering code package operation range at24c08-10pi-2.7 at24c08n-10si-2.7 at24c08-10ti-2.7 8p3 8s1 8a2 industrial (-40 c to 85 c) at24c08-10pi-1.8 at24c08n-10si-1.8 at24c08-10ti-1.8 8p3 8s1 8a2 industrial (-40 c to 85 c) package type 8p3 8-lead, 0.300" wide, plastic dual inline package (pdip) 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8a2 8-lead, 0.170" wide, thin shrink small outline package (tssop) options -2.7 low-voltage (2.7v to 5.5v) -1.8 low-voltage (1.8v to 5.5v)
17 at24c01a/02/04/08/16 0180r?seepr?4/04 notes: 1. for 2.7v devices used in the 4.5v to 5.5v range, please refer to performance values in the ac and dc characteristics ta ble. 2. this device is not recommended for new designs. please refer to at24c16a. at24c16 (2) ordering information ordering code package operation range at24c16-10pi-2.7 at24c16n-10si-2.7 at24c16-10ti-2.7 8p3 8s1 8a2 industrial (-40 c to 85 c) at24c16-10pi-1.8 at24c16n-10si-1.8 at24c16-10ti-1.8 8p3 8s1 8a2 industrial (-40 c to 85 c) package type 8p3 8-lead, 0.300" wide, plastic dual inline package (pdip) 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8a2 8-lead, 0.170" wide, thin shrink small outline package (tssop) options -2.7 low-voltage (2.7v to 5.5v) -1.8 low-voltage (1.8v to 5.5v)
18 at24c01a/02/04/08/16 0180r?seepr?4/04 packaging information 8p3 ? pdip 2325 orchard parkway san jose, ca 95131 title drawing no. r rev. 8p3 , 8-lead, 0.300" wide body, plastic dual in-line package (pdip) 01/09/02 8p3 b d d1 e e1 e l b2 b a2 a 1 n ea c b3 4 plcs top view side view end view common dimensions (unit of measure = inches) symbol min nom max note notes: 1. this drawing is for general information only; refer to jedec drawing ms-001, variation ba for additional information. 2. dimensions a and l are measured with the package seated in jedec seating plane gauge gs-3. 3. d, d1 and e1 dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.010 inch. 4. e and ea measured with the leads constrained to be perpendicular to datum. 5. pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 (0.25 mm). a 0.210 2 a2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 d 0.355 0.365 0.400 3 d1 0.005 3 e 0.300 0.310 0.325 4 e1 0.240 0.250 0.280 3 e 0.100 bsc ea 0.300 bsc 4 l 0.115 0.130 0.150 2
19 at24c01a/02/04/08/16 0180r?seepr?4/04 8s1 ? jedec soic 1150 e. cheyenne mtn. blvd. colorado springs, co 80906 title drawing no. r rev. note: 10/7/03 8s1 , 8-lead (0.150" wide body), plastic gull wing small outline (jedec soic) 8s1 b common dimensions (unit of measure = mm) symbol min nom max note a1 0.10 ? 0.25 these drawings are for general information only. refer to jedec drawing ms-012, variation aa for proper dimensions, tolerances, datums, etc. a 1.35 ? 1.75 b 0.31 ? 0.51 c 0.17 ? 0.25 d 4.80 ? 5.00 e1 3.81 ? 3.99 e 5.79 ? 6.20 e 1.27 bsc l 0.40 ? 1.27 ? 0? ? 8? ? top view end view side view e b d a a1 n e 1 c e1 l
20 at24c01a/02/04/08/16 0180r?seepr?4/04 8a2 ? tssop 2325 orchard parkway san jose, ca 95131 title drawing no. r rev. 5/30/02 common dimensions (unit of measure = mm) symbol min nom max note d 2.90 3.00 3.10 2, 5 e 6.40 bsc e1 4.30 4.40 4.50 3, 5 a ? ? 1.20 a2 0.80 1.00 1.05 b 0.19 ? 0.30 4 e 0.65 bsc l 0.45 0.60 0.75 l1 1.00 ref 8a2 , 8-lead, 4.4 mm body, plastic thin shrink small outline package (tssop) notes: 1. this drawing is for general information only. refer to jedec drawing mo-153, variation aa, for proper dimensions, toler ances, datums, etc. 2. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. dimension e1 does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. dambar cannot be located on the lower radius of the foot. minimum space between protrusion and adjacent lead is 0.07 mm. 5. dimension d and e1 to be determined at datum plane h. 8a2 b side view end view top view a2 a l l1 d 1 2 3 e1 n b pin 1 indicator this corner e e
21 at24c01a/02/04/08/16 0180r?seepr?4/04 8y1 ? map a ? ? 0.90 a1 0.00 ? 0.05 d 4.70 4.90 5.10 e 2.80 3.00 3.20 d1 0.85 1.00 1.15 e1 0.85 1.00 1.15 b 0.25 0.30 0.35 e 0.65 typ l 0.50 0.60 0.70 pin 1 index area d e a a1 b 8 7 6 e 5 l d1 e1 pin 1 index area 1 2 34 a top view end view bottom view side view 2325 orchard parkway san jose, ca 95131 title drawing no. r rev. 8y1, 8-lead (4.90 x 3.00 mm body) msop array package (map) y1 c 8y1 2/28/03 common dimensions (unit of measure = mm) symbol min nom max note
22 at24c01a/02/04/08/16 0180r?seepr?4/04 5ts1 ? sot23 1150 e. cheyenne mtn. blvd. colorado springs, co 80906 title drawing no. r rev. po5ts1 a 6/25/03 common dimensions (unit of measure = mm) symbol min nom max note 5ts1, 5-lead, 1.60 mm body, plastic thin shrink small outline package (shrink sot) a ? ? 1.10 a1 0.00 ? 0.10 a2 0.70 0.90 1.00 c 0.08 ? 0.20 4 d 2.90 bsc 2, 3 e 2.80 bsc 2, 3 e1 1.60 bsc 2, 3 l1 0.60 ref e 0.95 bsc e1 1.90 bsc b 0.30 ? 0.50 4, 5 notes: 1. this drawing is for general information only. refer to jedec drawing mo-193, variation ab, for additional information. 2. dimension d does not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end. dimension e1 does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.15 mm per side. 3. the package top may be smaller than the package bottom. dimensions d and e1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. 4. these dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 5. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. the dambar cannot be located on the lower radius of the foot. minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. 5 4 2 l1 l c end view c a a2 a1 b e seating plane d side view e1 e1 3 1 top view e
23 at24c01a/02/04/08/16 0180r?seepr?4/04 8u3-1 ? dbga2 1150 e. cheyenne mtn. blvd. colorado springs, co 80906 title drawing no. r rev. po8u3-1 a 6/24/03 common dimensions (unit of measure = mm) symbol min nom max note 8u3-1, 8-ball, 1.50 x 2.00 mm body, 0.50 mm pitch, small die ball grid array package (dbga2) a 0.71 0.81 0.91 a1 0.10 0.15 0.20 a2 0.40 0.45 0.50 b 0.20 0.25 0.30 d 1.50 bsc e 2.00 bsc e 0.50 bsc e1 0.25 ref d 1.00 bsc d1 0.25 ref 1. dimension 'b' is measured at the maximum solder ball diameter. this drawing is for general information only. bottom view 8 solder balls b d e top view pin 1 ball pad corner a side view a 2 a 1 4 5 pin 1 ball pad corner 3 1 e 2 6 7 8 d (e1) (d1) 1.
printed on recycled paper. 0180r?seepr?4/04 xm disclaimer: atmel corporation makes no warranty for the use of its products, other than those expressly contained in the company?s standar d warranty which is detailed in atmel?s terms and conditions located on the company?s web site. the company assumes no responsibi lity for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time wi thout notice, and does not make any commitment to update the information contained her ein. no licenses to patents or other intellectual property of atmel are granted by the company in connection with the sale of atmel products , expressly or by implication. atmel?s products are not aut horized for use as critical components in life support devices or systems. atmel corporation atmel operations 2325 orchard parkway san jose, ca 95131, usa tel: 1(408) 441-0311 fax: 1(408) 487-2600 regional headquarters europe atmel sarl route des arsenaux 41 case postale 80 ch-1705 fribourg switzerland tel: (41) 26-426-5555 fax: (41) 26-426-5500 asia room 1219 chinachem golden plaza 77 mody road tsimshatsui east kowloon hong kong tel: (852) 2721-9778 fax: (852) 2722-1369 japan 9f, tonetsu shinkawa bldg. 1-24-8 shinkawa chuo-ku, tokyo 104-0033 japan tel: (81) 3-3523-3551 fax: (81) 3-3523-7581 memory 2325 orchard parkway san jose, ca 95131, usa tel: 1(408) 441-0311 fax: 1(408) 436-4314 microcontrollers 2325 orchard parkway san jose, ca 95131, usa tel: 1(408) 441-0311 fax: 1(408) 436-4314 la chantrerie bp 70602 44306 nantes cedex 3, france tel: (33) 2-40-18-18-18 fax: (33) 2-40-18-19-60 asic/assp/smart cards zone industrielle 13106 rousset cedex, france tel: (33) 4-42-53-60-00 fax: (33) 4-42-53-60-01 1150 east cheyenne mtn. blvd. colorado springs, co 80906, usa tel: 1(719) 576-3300 fax: 1(719) 540-1759 scottish enterprise technology park maxwell building east kilbride g75 0qr, scotland tel: (44) 1355-803-000 fax: (44) 1355-242-743 rf/automotive theresienstrasse 2 postfach 3535 74025 heilbronn, germany tel: (49) 71-31-67-0 fax: (49) 71-31-67-2340 1150 east cheyenne mtn. blvd. colorado springs, co 80906, usa tel: 1(719) 576-3300 fax: 1(719) 540-1759 biometrics/imaging/hi-rel mpu/ high speed converters/rf datacom avenue de rochepleine bp 123 38521 saint-egreve cedex, france tel: (33) 4-76-58-30-00 fax: (33) 4-76-58-34-80 literature requests www.atmel.com/literature ? atmel corporation 2004 . all rights reserved. atmel ? and combinations thereof, are the registered trademarks, and dbga ? is the trademark of atmel corporation or its subsidiaries. other terms and product names may be the trademarks of others.

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